EW8002 NoSWEEP? Wire Bond Encapsulant
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產(chǎn)品名稱: EW8002 NoSWEEP? Wire Bond Encapsulant
產(chǎn)品型號: EW8002
產(chǎn)品展商: 其他品牌
產(chǎn)品文檔: 無相關(guān)文檔
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EW8002 NoSWEEP? Wire Bond Encapsulant
的詳細(xì)介紹
100% solid, silica filled liquid encapsulant designed for quick self-leveling in large dam & fill or glob top applications, & encapsulation of narrow diameter, long, & ultra fine pitch wire bonds on semiconductor devices. Low modulus & CTE, excellent adhesion to inorganic & organic substrates, thermally curable, & non-sweeping. Available in dam & fill or glob top versions.
MSDS / Technical Data Sheets / Product Literature
